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Stencils
BGA Reballing Stencils are precision templates used to replace or repair the solder balls on the underside of a Ball Grid Array (BGA) chip. The stencils allow for the accurate placement of solder balls onto the BGA pads before applying heat to reattach the component.
Mechanic 3D BGA Reballing Stencil
iPad Mini Air iPhone XR XS X 8 7 6S 6 5 4 3 2 NAND PCIE
$4.00
Memory BGA Stencil DDR5 GDDR5 K4G80325FB HC25 HC03 HC28 H5GQ8H24MJR R0C R4C K4G41325FC Direct Heat OR 90X90
$3.25 – $4.25
Memory BGA Stencil DDR6 GDDR6 D9WCW D9WCR K4Z80325BC-HC12 FBGA180 Direct Heat 90X90
$3.25 – $4.25
Memory BGA Stencil GDDR5 DDR5 D9VRL D9VRK D9TXS D9V 190FBGA Direct Heat OR 90X90
$3.25 – $4.25
QianLi 3D BGA Stencil Reballing Reball iPad iPhone XR XS X 8 7 6 S 5 4 NAND PCIE
iPhone / iPad iBlack 3D Stencil BGA 60 BGA70 BGA110
$3.50
Reball Stencil for PS3 Slim South Bridge CXD9963GB
$2.25 – $3.25
