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KINGBO RMA-218 10cc
High viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages
25 in stock
Description
Description
KINGBO RMA-218 10cc
High viscosity no-clean flux that can be used for rework, sphere or pin attachment to BGA, CGA and CSP packages, and assembly operations such as Flip Chip attachment to PWB substrates.
It is original made in Japan.
Good formula for BGA reballing / balls works it can stick the balls much more.
Additional information
Additional information
| Weight | 4 oz |
|---|---|
| Dimensions | 8 × 6 × 1 in |
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